Summary：RIBER Lands Exciting New Order from 3SP Technologies for Advanced Production Platform Bezons (Franc

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RIBER Lands Exciting New Order from 3SP Technologies for Advanced Production Platform
Bezons (France), July 9, 2026 – 8:00 am (CET) – RIBER, a global market leader in molecular beam epitaxy (MBE) and advanced thin‑film deposition systems, announced today that it has secured a significant order from 3SP Technologies for a next‑generation production platform. The deal underscores RIBER’s continued strength in supplying high‑precision equipment to innovators driving the semiconductor and optoelectronics sectors.

**Introduction**
The new contract calls for the delivery of a fully integrated MBE‑based production line capable of epitaxial growth on large‑area substrates with sub‑nanometer thickness control. 3SP Technologies, a fast‑growing developer of photonic integrated circuits and quantum‑dot devices, selected RIBER after a rigorous evaluation of throughput, reliability, and process flexibility. The platform will be installed at 3SP’s R&D hub in Bezons and is slated for commissioning in Q1 2027.

**Key Developments**
- **Scope of Supply:** The order includes a custom‑configured MBE reactor, automated wafer handling, in‑situ diagnostics, and a proprietary software suite for recipe management and yield optimization.
- **Technical Specifications:** Capable of handling 200 mm wafers, the system offers growth rates up to 2 µm/h with temperature uniformity better than ±0.5 °C across the substrate.
- **Strategic Fit:** For RIBER, the contract reinforces its positioning as a preferred supplier for high‑mix, low‑volume production environments where rapid process changes are essential. For 3SP, the platform accelerates its roadmap toward commercial‑scale quantum‑dot lasers and silicon‑photonic components.

**Industry Analysis**
The global MBE equipment market is projected to exceed USD 1.2 billion by 2030, driven by demand for compound semiconductors in 5G/6G infrastructure, sensing, and quantum