Summary：TSMC Unveils Exciting Three New Advanced Packaging Fabs in Chiayi Science Park **Introduction** Ta

TSMC Unveils Exciting Three New Advanced Packaging Fabs in Chiayi Science Park

**Introduction**
Taiwan Semiconductor Manufacturing Company (TSMC) announced on Monday the construction of three state‑of‑the‑art advanced packaging facilities within Chiayi Science Park. The move underscores the foundry’s commitment to expanding its heterogeneous integration capabilities as demand for chiplet‑based designs and AI accelerators continues to surge. By locating the new fabs in southern Taiwan, TSMC aims to leverage existing infrastructure, talent pools, and government incentives while reducing logistics bottlenecks for its northern‑based wafer fabs.

**Key Developments**
Each of the three packaging fabs will focus on a distinct technology node: 2.5‑D interposer‑based integration, fan‑out wafer‑level packaging (FOWLP), and chip‑on‑wafer‑on‑substrate (CoWoS) advanced stacking. The first facility, slated for completion in late 2026, will dedicate ~150,000 sq m to 2.5‑D lines that support high‑bandwidth memory (HBM) attachment for GPUs and AI processors. The second fab, expected to begin pilot runs in early 2027, will expand FOWLP capacity to accommodate the growing market for mobile SoCs and 5G modem chips. The third plant, targeting mass production by 2028, will enhance Co