Summary：HPQ Announces Share‑Based Debt Settlement, Boosting Investor Confidence MONTREAL, July 22, 2026 (GLHPQ Announces Share‑Based Debt Settlement, Boosting Investor Confidence
MONTREAL, July 22, 2026 (GLOBE NEWSWIRE) — HPQ Silicon Inc. (“HPQ” or the “Company”) (TSX‑V: HPQ, OTCQB: HPQFF, FRA: O08), a technology firm specializing in advanced materials and critical process technologies, today disclosed a share‑based debt settlement that is expected to strengthen its balance sheet and reinforce investor confidence.
**Key Developments**
HPQ announced that it has reached an agreement with a group of institutional creditors to exchange approximately CAD 45 million of outstanding senior unsecured notes for newly issued common shares. The transaction, structured at a conversion price of CAD 2.30 per share, will result in the issuance of roughly 19.6 million shares, representing about 12 % of the post‑transaction equity base. The settlement eliminates cash interest payments of roughly CAD 3.2 million annually and reduces the company’s net debt‑to‑EBITDA ratio from 3.4× to 2.1×. HPQ’s CEO, Dr. Marie‑Claude Lefebvre, stated, “By converting debt into equity, we align the interests of our lenders with those of our shareholders while preserving liquidity for ongoing R&D initiatives in silicon‑based photonics and high‑purity quartz processing.”
**Industry Analysis**
The move comes amid a broader trend in the advanced materials sector, where firms are leveraging equity‑based restructurings to mitigate financing costs amid rising interest rates. Analysts at Raymond James note that share‑based swaps can improve credit metrics without diluting operational focus, especially for companies like HPQ that are investing heavily in next‑generation semiconductor substrates. The settlement also positions HPQ more favorably relative to peers such as Showa Denko and
